Highly Compact Wafer Level Package SiPM
A wafer-level package based on TSV technology with excellent compactness, and almost the entire front surface is photosensitive area
The photosensitive area accounts for up to 99%, the package size equals chip size is basically achieved, you can splice it happily
With a new wafer-level package, integrated thinness, miniaturization and reliability together
Vertical interconnection achieved by TSV technology, lithography technology wiring, signal path accuracy is up to micron level, effectively reduce signal transmission fluctuations and increase signal uniformity
Up to 35% Peak wavelength photon detection efficiency, gives TP series SiPM excellent photon capture capability
TP series SiPM features single photon sensitivity and it’s very easy to capture of low light signals
