On March 25th, Joinbon released a new SMT product with a more compact package. The active area of the product is 1mm × 1mm, and the package size is dramatically reduced to 1.4mm × 1.7mm. It is the smallest product among Wire-bond structure SiPM in the industry.
This new product from Joinbon is designed for the industry of hazard and threat detection, fluorescence analysis and other areas with high spatial resolution requirements, enabling smaller and more compact packages with the same active area, enabling electronic systems to achieve higher spatial resolution. The main performance parameters of this product are as follows:
geometry parameter
performance parameter
